From f83fca0707c66e36f14efef7f68702cb12de70b7 Mon Sep 17 00:00:00 2001
From: Peter Griffin <peter.griffin@linaro.org>
Date: Fri, 5 Sep 2014 16:36:30 +0100
Subject: [PATCH] usb: dwc3: add ST dwc3 glue layer to manage dwc3 HC

This patch adds the ST glue logic to manage the DWC3 HC
on STiH407 SoC family. It manages the powerdown signal,
and configures the internal glue logic and syscfg registers.

[ balbi@ti.com : actually switch over to of_platform_depopulate() ]

Signed-off-by: Giuseppe Cavallaro <peppe.cavallaro@st.com>
Signed-off-by: Peter Griffin <peter.griffin@linaro.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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Reading git-format-patch failed