From b81b6ba3d9ac5feb14388bb73ac5a39d9a7540dc Mon Sep 17 00:00:00 2001
From: Zhang Rui <rui.zhang@intel.com>
Date: Wed, 27 Jun 2012 10:08:19 +0800
Subject: [PATCH] Thermal: rename structure thermal_cooling_device_instance to
 thermal_instance

This struct is used to describe the behavior for a thermal
cooling device on a certain trip point for a certain thremal zone.

thermal_cooling_device_instance is not accurate, as a cooling device
can be used for more than one trip point in one thermal zone device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
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Reading git-format-patch failed