From 834db4bcdf937b9f06122a633672ee5acd77085b Mon Sep 17 00:00:00 2001
From: dingtianhong <dingtianhong@huawei.com>
Date: Sat, 21 Dec 2013 14:40:17 +0800
Subject: [PATCH] bonding: ust micro BOND_NO_USE_ARP to simplify the mode check

The bond 3ad and TLB/ALB has the same check path, so combine them.

Signed-off-by: Ding Tianhong <dingtianhong@huawei.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
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Reading git-format-patch failed