From 359836e1de4d32a647bf2c1f99d84d2ff0a098bd Mon Sep 17 00:00:00 2001
From: Eduardo Valentin <eduardo.valentin@ti.com>
Date: Wed, 29 May 2013 15:07:41 +0000
Subject: [PATCH] thermal: ti-soc-thermal: remove external heat while
 extrapolating hotspot

For boards that provide a PCB sensor close to SoC junction
temperature, it is possible to remove the cumulative heat
reported by the SoC temperature sensor.

This patch changes the extrapolation computation to consider
an external sensor in the extrapolation equations.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
---
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