From: Guennadi Liakhovetski Date: Wed, 23 Mar 2011 11:42:44 +0000 (+0100) Subject: mmc: tmio: split core functionality, DMA and MFD glue X-Git-Tag: v2.6.39-rc1~1^2~13 X-Git-Url: http://git.openpandora.org/cgi-bin/gitweb.cgi?a=commitdiff_plain;h=b6147490e6aac82fa2f4b9d7fce925d9891ebe8f;p=pandora-kernel.git mmc: tmio: split core functionality, DMA and MFD glue TMIO MMC chips contain an SD / SDIO IP core from Panasonic, similar to the one, used in MN5774 and other MN57xx controllers. These IP cores are included in many multifunction devices, in sh-mobile chips from Renesas, in the latter case they can also use DMA. Some sh-mobile implementations also have some other specialities, that MFD-based solutions don't have. This makes supporting all these features in a monolithic driver inconveniet and error-prone. This patch splits the driver into 3 parts: the core, the MFD glue and the DMA support. In case of a modular build, two modules will be built: mmc_tmio_core and mmc_tmio. Signed-off-by: Guennadi Liakhovetski Acked-by: Paul Mundt Signed-off-by: Chris Ball --- Reading git-diff-tree failed