From: Jingoo Han <jg1.han@samsung.com>
Date: Tue, 4 Nov 2014 02:01:47 +0000 (+0900)
Subject: usb: dwc3: exynos: remove non-DT support for Exynos Specific Glue layer
X-Git-Tag: omap-for-v3.19/fixes-rc1~87^2~32^2~97
X-Git-Url: http://git.openpandora.org/cgi-bin/gitweb.cgi?a=commitdiff_plain;h=b4c9f578cb9608f7de0c89aa637a6af4a48061ef;p=pandora-kernel.git

usb: dwc3: exynos: remove non-DT support for Exynos Specific Glue layer

DWC3 Exynos Specific Glue layer can be used only for Exynos SoCs.
In addition, non-DT for EXYNOS SoCs is not supported from v3.11;
thus, there is no need to support non-DT for DWC3 Exynos Specific
Glue layer.

The 'linux/platform_data/dwc3-exynos.h' file has been used for
non-DT support. Thus, the 'dwc3-exynos.h' file is removed, because
it is not used anymore.

Signed-off-by: Jingoo Han <jg1.han@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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