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ACPICA: Fixed a memory leak when Device or Thermal objects referenced in packages
authorBob Moore <robert.moore@intel.com>
Thu, 10 Apr 2008 15:06:39 +0000 (19:06 +0400)
committerLen Brown <len.brown@intel.com>
Tue, 22 Apr 2008 18:29:26 +0000 (14:29 -0400)
Problem introduced in fix for Package references.

Signed-off-by: Bob Moore <robert.moore@intel.com>
Signed-off-by: Alexey Starikovskiy <astarikovskiy@suse.de>
Signed-off-by: Len Brown <len.brown@intel.com>

No differences found
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