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ARM: dts: omap3: Add support for IGEP COM Module
authorJavier Martinez Canillas <javier.martinez@collabora.co.uk>
Wed, 19 Dec 2012 13:33:10 +0000 (14:33 +0100)
committerBenoit Cousson <benoit.cousson@linaro.org>
Mon, 8 Apr 2013 22:16:46 +0000 (00:16 +0200)
ISEE IGEP COM Module is an TI OMAP3 SoC computer on module.

This patch adds an initial device tree support to boot an
IGEP COM Module from the MMC/SD.

Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[b-cousson@ti.com: Update the Makefile for 3.8-rc2]
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>

No differences found
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