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usb: musb: introduce DA8xx/OMAP-L1x glue layer
authorSergei Shtylyov <sshtylyov@ru.mvista.com>
Fri, 24 Sep 2010 10:44:03 +0000 (13:44 +0300)
committerGreg Kroah-Hartman <gregkh@suse.de>
Fri, 22 Oct 2010 17:21:52 +0000 (10:21 -0700)
Texas Instruments DA8xx/OMAP-L1x glue layer for the
MUSBMHRDC driver.

Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Yadviga Grigorieva <yadviga@ru.mvista.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
drivers/usb/musb/Kconfig patch | blob | history
drivers/usb/musb/Makefile patch | blob | history
drivers/usb/musb/da8xx.c [new file with mode: 0644] patch | blob
drivers/usb/musb/musb_core.h patch | blob | history

diff --cc drivers/usb/musb/Kconfig
Simple merge
diff --cc drivers/usb/musb/Makefile
Simple merge
diff --cc drivers/usb/musb/da8xx.c
Simple merge
diff --cc drivers/usb/musb/musb_core.h
Simple merge
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