usb: musb: introduce DA8xx/OMAP-L1x glue layer
authorSergei Shtylyov <sshtylyov@ru.mvista.com>
Fri, 24 Sep 2010 10:44:03 +0000 (13:44 +0300)
committerGreg Kroah-Hartman <gregkh@suse.de>
Fri, 22 Oct 2010 17:21:52 +0000 (10:21 -0700)
Texas Instruments DA8xx/OMAP-L1x glue layer for the
MUSBMHRDC driver.

Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Yadviga Grigorieva <yadviga@ru.mvista.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>

No differences found