Merge patch series "Improve Verdin AM62P thermal setup by generalizing ft_board_setup...

Merge patch series "Improve Verdin AM62P thermal setup by generalizing ft_board_setup_ex()"

João Paulo Gonçalves <jpaulo.silvagoncalves@gmail.com> says:

In some use cases, board-specific device tree changes must not be overwritten
by system fixups. Although U-Boot provides ft_board_setup_ex() for this
purpose, it is currently only used on TI Keystone. This series makes
ft_board_setup_ex() a generic option, allowing its use by other architectures
and boards.

Additionally, considering that Toradex Verdin-AM62P hardware lifetime
guarantees are based on a 105°C junction temperature (while TI AM62Px supports
up to 125°C), this series implements necessary changes within TI K3 AM62P and
Toradex board code. These changes include exporting common fixup device Tree
functions used in TI K3 for board-code access and also fixup for AM62P thermal
zones to correctly reflect the number of CPU nodes according to the SoC part
number.

Link: https://lore.kernel.org/r/20250623-am62p-fdt-fixup-trip-points-v1-0-12355eb6a72f@toradex.com